The Z-Gripper Module is the primary transfer robot for a memory chip sorter. The key function is the physical picking and placing/sorting of fully tested integrated circuits (memory chips). It is attached to an overhead gantry assembly and moves in X, Y, and Z axis. The Z-Gripper uses vacuum to pick and place the components after test.

Tolerancing / Unique Processes
Most tolerances required are industry standard. The unique challenge of the Z-Gripper Module is the assembly process itself. This compact assembly requires very specific routing for all cables and pneumatic tubing. This routing prevents interferences or other entanglements while operating at design speeds.

The Tray Module assembly is the material-handling portion of a semiconductor robotic sorter. Robotic sorters are used in the back end of the chip making process to sort and separate good product from bad after test. The Tray Module's primary function is to move Jedec carrier trays full of integrated circuits in and out of the sorter, using a series of elevators, carrier belts, and guides.

Tolerances / Unique Processes
The majority of the machined components have tighter than standard tolerances ( .002 +/ - .001 ). The elevator lift arms have a particularly difficult flatness requirement for the geometry of the part. The Tray Module also required a series of difficult alignments during the manufacturing process. This module also included globally sourced components.

Load / Unload Module
The Load / Unload Module assembly is a robotic module integrated into the front portion of a semiconductor handler. The function of this assembly is the initial loading stage (untested devices) and final exiting stage (fully tested devices) for Jedec handling trays. This Load/Unload Module acts as an elevator, indexing trays up to load and down to unload the core handler.

Tolerancing / Unique Processes
The Load/ Unload Module has a cross section of machined aluminum and stainless steel components. Most of the components require standard tolerances but many have challenging geometries. The most challenging requirement of this assembly is the alignment of the tray gripper sub-assemblies as well as the odd shape of the completed assembly.

This Test Robot is the heart of a semiconductor-handling machine. It is a four axis ( X, Y, Z, Theta Z ) thermally controlled chuck with a temperature range of -55 degrees C to +155 degrees C. The Test Robot's function is to "plunge" integrated circuits in strip form prior to singulation. Integrated circuits are presented to the electronic tester with a high degree of accuracy and speed. The Test Robot moves at 48" per second and will accurately contact devices as low as a 3mm pitch.

Tolerances / Integrated Processes
"Stacked up" tolerances and the multiple machined "layers" of this assembly, combined to create the most challenging aspect of manufacturing this Test Robot. Components are required to maintain a co-planarity of .0002" on all stacked components. One of the more difficult components was the thermal plate. This sub assembly is a stack up of vacuum brazed aluminum parts, heaters and fittings requiring a delicate machining operation after assembly.